Saturday, December 27, 2008
Saturday, December 20, 2008
Wednesday, November 26, 2008
Wednesday, November 5, 2008
Tuesday, October 28, 2008
Sunday, October 5, 2008
Copper heat sinks vs. Aluminum heat sinks
In such cases where high power components has to be cooled within a limited space copper heat sinks are considered as a substitute to Aluminum ones.
The change is justified when the footprint area of the component is substantially smaller than that of the foot print area of the heat sink base.
This change is associated with an increased cost of a factor of 2 as copper can not be extruded or easily stamped. Weight is increased by a factor of 3 and thermal resistance is reduced by a factor much smaller than 2.
This means that the increase in weight and cost when using copper heat sink is justified only in marginal cases where the relatively small reduction in thermal resistance justifies the large increase in weight and cost
Alpha corp. from Japan is manufacturing a hybrid heat sink with a copper plate metalurgically embedded in the aluminum base, thus improving the heat spreading in the base and the fins temperature near the edges, while the fins and the upper section of the base attached thereto are made from aluminum.
Example of such improvement in performance (reduction of thermal resistance) can be noticed when comparing geometrically identical heat sinks one with aluminum base and the other with partially aluminum base with embedded copper therein as in the following links.
http://www.alphanovatech.com/cat_ube.html; http://www.alphanovatech.com/cat_ubce.html
Coolinnovations corp. from Canada supplies whole copper heat sinks which are limited in footprint dimensions. Similar comparison between copper and aluminum can be made in coolinnovations web-site. www.coolinnovations.com.
Monday, September 22, 2008
Thursday, September 18, 2008
Monday, September 15, 2008
Tuesday, September 9, 2008
SILRAM-COR LINE CARD 2
Heat sinks and CPU Coolers
Maximal Temperature Measurement Labels
Thermo Electric Modules and their controllers
Office address: 10 Yad Harutzim
Kfar-Saba
Tel: +972-9-7654000
Fax: +972-9-7658000
E-mail: sales@silram-cor.co.il
- Alpha Japan AlpaNovatech
- Coolinnovations
- LDS
- R-theta
Maximal Temperature Measurement Labels
- Hallcrest
Thermo Electric Modules and their controllers
- Ferrotec
- CustomChill
- Ferrotec
- LDS
- Caliente
Office address: 10 Yad Harutzim
Kfar-Saba
Tel: +972-9-7654000
Fax: +972-9-7658000
E-mail: sales@silram-cor.co.il
SILRAM-COR LINE CARD
Fans & Accessories
Office address: 10 Yad Harutzim
Kfar-Saba
Tel: +972-9-7654000
Fax: +972-9-7658000
E-mail: sales@silram-cor.co.il
- NMB FANS
- T&T Grand Land International Ltd.
- Pelko Motors
- Fandis
- Alfatec - Kerafol
- Laird-Technologies
- T-global
- Thermacore
- Thermshield
Office address: 10 Yad Harutzim
Kfar-Saba
Tel: +972-9-7654000
Fax: +972-9-7658000
E-mail: sales@silram-cor.co.il
Monday, September 8, 2008
Forced Convection Heaters - Caliente Silram-Cor סילרם-קור
Forced Convection Heaters - Caliente Silram-Cor סילרם-קור
Benefits:
Phone: 972-9-7654000
Silram-Cor
Benefits:
- Self Regulating PTC Technology
- Versatility
- Ease of Installation
- Compact Design
- Overall Value
Phone: 972-9-7654000
Silram-Cor
Thursday, September 4, 2008
heat pipes
Heat-pipe or thermal-pipe is a device which is capable of long distances heat transfer at very low temperature losses.
The heat pipe is composed of a tube the internal envelope thereof is covered by a thin layer of porous wick which enable water to flow capillary in the wick from one end of the heat pipe to the other end.
The wick is saturated with water after which the heat pipe is sealed under vacuum which keep the heat pipe internally at a pressure much below the atmospheric pressure.
When a section of the heat pipe, referred to as the evaporator, is warmed up, such as by a hot component, the water within the wick under the low pressure evaporate at low temperature absorbing the evaporating heat from the component.
The vapor is flowing quickly to the cold end(s) and warms them up where the heat is removed from the vapor in the cold ends for example by an air cooled heat sink or water cooled cold plate. The removal of heat condense back the vapor into water in the condenser section.
Due to the capillary pressure existing between the saturated condenser and the dry evaporator the water will flow capillary back to the evaporator where they will be evaporated again and flow back to the condenser as vapor.
The main temperature drop is at the condenser and evaporator sections while the flow of the vapor along the heat-pipe is causing very little temperature drop in the range of 1 degrees regardless the length of the heat-pipe.
Heat pipes are used to transfer heat from a place where there is no possibility and means to remove it to a place where the heat can be removed. Another common use of heat pipes to turn the base of heat sinks isothermals such as the base of a large heat sinks with concentrated heat source which increase the heat dissipation capacity of the heat sink without the need of changing its dimensions or increasing the air flow pattern in-between the fins
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